Wire-bonding-in-microelectronics-naterials-orocesses-reliability-and-yield

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Wire bonding in microelectronics naterials, orocesses, reliability and yield

Author

: HARMAN, George

Edition

: Edisi 2 Jilid 0 Cetakan 1

Editor

Collation

: xiii, 290 p. ,24 cm 16 cm 0 cm

Subject

Publisher

: McGraw - Hill Book Company

Year

: 1997

ISBN

: 0-07-032619-3

Call Number

: 621.381.5 Har w

Summary :
Wire bonding in microelectronics materials, processes, reliability, andyield

Copies :

No.	Barcode	Location	No. Shelf	Availability
1	2003120135	Perpustakaan Pusat UMY	600	Tersedia

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